文章资讯
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- 2014-11-11 A*STAR IME develops ultra low power analog-to-digital converter for medical devices and wireless sensor nodes
- Researchers from A*STAR IME have developed an analog-to-digital converter (ADC) that uses only 400 nW, the lowest power consumption reported to date amongst today’s standard processing technology.
The novel converter design decreases the total power consumption of an implantable 100-channel neural recording microsystem by more than 20%, reducing the patient’s exposure to electromagnetic radiation in the brain tissue when powered wirelessly during the data acquisition of complex brain activity for medical purposes. The converter can also prolong the battery life of other wearable and implantable medical devices and wireless sensor nodes. - See Details
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- 2014-11-11 SEMATECH achieves world-class defect reductions in EUV
- SEMATECH announced today that researchers have reached a significant milestone in reducing tool-generated defects from multi-layer deposition of mask blanks used for extreme ultraviolet lithography (EUVL), bringing that technology a step closer to high-volume manufacturing.
Following a two-year effort to improve deposition tool hardware, process parameters and substrate cleaning techniques, technologists deposited EUV multilayers with as few as eight defects per mask at 50 nm sensitivity (SiO2 equivalent), which includes 6 substrate defects, one handling defect and one defect from the multi-layer deposition process. This result was achieved on a 40 bi-layer film stack with an Ru cap and measured over the mask blank quality area of 132 x 132 mm2.
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- 2014-11-10 Digital processors limited by power; what's the upside?
Today’s Defense missions rely on a massive amount of sensor data collected by intelligence, surveillance and reconnaissance (ISR) platforms. Not only has the volume of sensor data increased exponentially, there has also been a dramatic increase in the complexity of analysis required for applications such as target identification and tracking. The digital processors used for ISR data analysis are limited by power requirements, potentially limiting the speed and type of data analysis that can be done. A new, ultra-low power processing method may enable faster, mission critical analysis of ISR data.
The Unconventional Processing of Signals for Intelligent Data Exploitation (UPSIDE) program seeks to break the status quo of digital processing with methods of video and imagery analysis based on the physics of nanoscale devices. UPSIDE processing will be non-digital and fundamentally different from current digital processors and the power and speed limitations associated with them.
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- 2014-11-10 Toshiba develops dysprosium-free samarium-cobalt magnet to replace heat-resistant neodymium magnet
Toshiba Corporation announced today that the company has developed a high-iron concentration samarium-cobalt magnet that is free of dysprosium, a rare earth mineral that is in extremely short supply and increasingly expensive. At typical operating temperatures, the samarium-cobalt magnet has superior magnetic properties to the heat-resistant neodymium magnets currently used in motors.
The traction motors for hybrid and electric automobiles, railroad vehicles, and the motors for industrial equipment operate at relatively high temperatures, and heat-resistant neodymium magnets are generally used in these applications. However, dysprosium is a key material of these magnets. Current sources of dysprosium are limited, and recent export limitations and price rises are raising global concerns for future shortages. In these circumstances, the development of dysprosium-free high performance magnets that offer a strong magnetic force at high operating temperatures is an important objective for the industry.
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- 2014-11-10 Fujitsu releases 24 new wide voltage 8-bit microcontrollers featuring LCD control functionality
- Fujitsu Semiconductor today announced the addition of new products to its "New 8FX" family of high-performance 8-bit microcontrollers, including 12 products from the 64-pin MB95770 Series and 12 products from the 80-pin MB95710 Series, both of which feature LCD control functionality and support a wide voltage operation range from 1.8V to 5.5V. Sample quantities of these new products will begin shipping today.
The MB95770 Series and MB95710 Series, which feature LCD control functionality, are low-cost, low-power consumption 8-bit microcontrollers for a wide range of applications in both domestic and overseas products, including display panel applications ranging from battery-powered healthcare devices such as blood pressure and blood glucose level meters, to home appliances including washing machines and air conditioner indoor units, and FA devices such as thermometers and pressure gauges.
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- 2014-11-10 High-frequency multilayer inductor series with world's highest inductance value
- TDK Corporation expanded its MLG0402Q series of high-frequency multilayer inductors with new types that achieve inductance values of up to 33 nH, the world's highest for a tiny 0402 inductor (EIA). With the development of these new components, the TDK MLG0402Q series now includes a total of 55 types with inductance values ranging from 0.2 nH to 33 nH, rated currents from 120 mA to 350 mA, and typical DC resistance values from 0.03 Ω to 2.71 Ω. Mass production began in August 2012.
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- 2014-11-10 New chip for high-frequency RFID tags with industry-leading 9 KB FRAM
Fujitsu Semiconductor Europe (FSEU) today announced a new arrival to its FerVID family of chips for RFID tags. As with all members of the FerVID family, the MB89R112 series uses ferroelectric memory (FRAM) for fast write speeds, high-frequency rewritability, radiation tolerance and low-power operation. With industry-leading 9 KB memory, the series offers tailored solutions for factory automation and medical equipment as well as for embedded and industrial applications.
Since 2004, Fujitsu has developed FRAM products as part of the FerVID family with two frequency bands, for use as chips in high-functionality RFID tags operating in the HF band (13.56 MHz) and UHF band (860 to 960 MHz). Today, its products serve a wide range of applications, including chips for data-carrier tags in the factory automation and maintenance sectors, chips capable of withstanding gamma radiation or electron beams for the medical and pharmaceutical sectors, and chips with serial interfaces for embedded applications.
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- 2014-11-10 NXP delivers breakthrough performance in DisplayPort and HDMI switches
- NXP Semiconductors today announced two high-performance switches supporting DisplayPort and HDMI architectures. The latest additions to NXP's high-speed computing portfolio include the CBTL06DP213, a bi-directional switch for DisplayPort 1.2 applications featuring industry-leading bandwidth over 11 GHz; and the CBTL06GP212, the industry's first switch to enable simultaneous support for both DisplayPort 1.2 and HDMI 1.4. Both are multi-channel capable devices designed using NXP's high-bandwidth analog pass-gate technology. NXP will demonstrate the new switches at the Intel Developer Forum (IDF2012) in San Francisco, Sept. 11-13.
"DisplayPort and HDMI have evolved to support very high-bandwidth audio/visual applications, and OEMs worldwide are embracing these standards in computing systems, mobile devices and displays," said Grahame Cooney, general manager, high-speed interfaces and clocks, watches and graphics drivers, NXP Semiconductors. - See Details
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- 2014-11-10 Fujitsu demonstrates ultra high-speed short-reach data transmission based on multi-level signalling, advanced ADC/DAC
- Fujitsu Semiconductor Europe has demonstrated the transmission of >100Gbps over a single CEI-28G-VSR channel, effectively quadrupling the data rate throughput defined by the Optical Internetworking Forum (OIF) for this chip-to-chip electrical interface. This serves as a benchmark for what can be achieved over short-reach electrical channels using the same field-proven CMOS converter technology deployed in long-haul optical transport systems today. Key to the study is a comparison of the relative advantages and disadvantages of PAM (Pulse-amplitude Modulation) encoding versus DMT (Discrete Multi-Tone) over this particular channel. FSEU's test and demonstration platform is based on the test chips and evaluation boards for the family of 40nm, 65GSps CMOS converters ("LEIA" DAC for transmit and "LUKE" ADC for receive).
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- 2014-11-10 Fast and flexible: Electronics for the next generation
The demand for smaller devices with more features and increased battery life seems insatiable-and electrical and computer engineering Professor Zhenqiang (Jack) Ma is keeping up with that pace, working tirelessly to improve the technology that could power the next generation of mobile electronics.
Ma's work centers on fast, flexible electronics-circuits that can bend to any shape without sacrificing performance. He's been refining techniques for designing chips on silicon nanomembranes, developing faster methods of "carving" circuitry into these thin, stretched layers of insulated silicon using patterned adhesive membranes to pull off layers of insulation. "They use a single crystal material, which offers a much higher speed than can be realized using other materials," says Ma, of his devices. "So far, we have gotten as high as 12 gigahertz (GHz)."
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- 2014-11-10 Renesas introduces 32-bit RX21A group of microcontrollers with large memory capacity and built-in A/D converter
Renesas Electronics announced the RX21A Group of 32-bit microcontrollers (MCUs) for smart meters with advanced functionality. The new MCUs are the first in the industry to combine large flash memory capacity of 512 KB and a 24-bit delta-sigma (Delta-sigma) A/D converter for high-resolution measurement.
The RX21A Group of MCUs implements in a single chip functions that previously required separate devices, such as powermeasurement, meter control, calculation of electricity charges, and data encryption. This reduces the number of external components required and helps to lower the overall cost. In addition, the RX21A Group includes product versions for a variety of meter models, allowing common and effective system design.
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- 2014-11-10 Silicon carbide solutions to solar challenges revealed
STMicroelectronics is revealing innovations in silicon carbide devices at Solar Power International (SPI) 2012 that enable systems producers to build ultra-efficient electronics for converting raw solar energy into grid-quality power.
Featuring on the ST booth at SPI, the Company's 1200V silicon carbide diodes replace ordinary silicon diodes in the DC-DC boost converter and DC-AC inverter that convert the photovoltaic module's low-voltage output into high-quality AC power at the correct line voltage.
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- 2014-11-08 Learning from sand castles to build future chips
- In the United States, data centers already consume two percent of the electricity available with consumption doubling every five years. In theory, at this rate, a supercomputer in the year 2050 will require the entire production of the United States' energy grid.
To address this challenge IBM scientists are researching vertically stacked chips, also known as 3D chip stacks. Right now they are developing innovative manufacturing solutions using a natural phenomenon that children around the world appreciate every summer while building sand sculptures—capillary bridging in wet sand.
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- 2014-11-08 Radiation-enabled chips could lead to low-cost security imaging systems
- With homeland security on high alert, screening systems to search for concealed weapons are crucial pieces of equipment. But these systems are often prohibitively expensive, putting them out of reach for public spaces such as train and bus stations, stadiums, or malls, where they could be beneficial.
Now Dr. Eran Socher of Tel Aviv University's Faculty of Engineering is reconfiguring existing complementary metal-oxide-semiconductor (CMOS) chips designed for computers and turning them into high frequency circuits. The ultimate goal is to produce chips with radiation capabilities, able to see through packaging and clothing to produce an image of what may be hidden underneath.
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- 2014-11-08 'Memristors' based on transparent electronics offer technology of the future
- (Phys.org)—The transparent electronics that were pioneered at Oregon State University may find one of their newest applications as a next-generation replacement for some uses of non-volatile flash memory, a multi-billion dollar technology nearing its limit of small size and information storage capacity.
Researchers at OSU have confirmed that zinc tin oxide, an inexpensive and environmentally benign compound, has significant potential for use in this field, and could provide a new, transparent technology where computer memory is based on resistance, instead of an electron charge.
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- 2014-11-08 Cutting-edge startup aims for nano-close shave
- (Phys.org)—A new startup company at UC Davis aims to bring you a better shave through semiconductor manufacturing technology. Nano-Sharp Inc. plans to use silicon wafers to make razor blades and surgical tools far more cheaply than current silicon or ceramic blades.
It's one of three new companies in the College of Engineering's incubator, the Engineering Translational Technology Center. The new businesses hope to grow into viable companies that attract private funding.
"Every single one of these companies is looking at a multibillion dollar market," said Jim Olson, the center's business specialist and a visiting assistant professor at the UC Davis Graduate School of Management.
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- 2014-11-08 Mobile-device technology: First on-chip CMOS power detector with temperature compensation
- Fujitsu Laboratories today announced that it has developed a CMOS power detector with built-in temperature compensation, featuring a compact design and low power consumption suitable for use in smartphones and other mobile terminals.
Reducing the mounted area required for components and circuits in mobile terminals is an important factor in reducing their size and cost, but they occupy a relatively large mounted area, because the power detectors used in the transmitters for wireless communications terminals are typically comprised of several radio-frequency (RF) amplifiers. Diodes are known to be an alternative for making power detectors smaller, but their characteristics change with temperature, and the temperature compensation they require has been problematic.
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- 2014-11-08 Fujitsu introduces new FRAM-based device for radio frequency ID applications
Fujitsu Semiconductor America has introduced a new FRAM-based device with the industry's highest memory capacity for a high-frequency RFID (radio frequency ID) IC.
The MB89R112 is the latest member of the Fujitsu FerVID Family, which uses FRAMmemory for fast write speeds and high-frequency rewriting capabilities, providing excellent radiation tolerance and low-power operation. The device includes 9 kilobytes (KB) of FRAM, with a full 8 KB available as user memory. Memory is structured as 256 blocks of 32 bytes per block, permitting read and write access to the entire 8 KB region defined in ISO/IEC15693. Writing 8 KB of data takes about four seconds, a high-speed operation six times faster than products using EEPROM.
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- 2014-11-08 Atomic layer deposition passivation for high-efficiency i-PERC silicon solar cells
At this week's European Photovoltaic Solar Energy Conference and Exhibition (27th EUPVSEC, 24/08-28/08), imec, RENA and SoLayTec present thin (165µm), large area (156x156mm2) i-PERC-type Silicon solar cells with ALD (atomic layer deposition) passivation achieving a cell efficiency of 19.6% without selective emitter using an industrial screen printing process flow.
The solar cell manufacturing has been performed within imec's solar cell pilot line using RENA in-line lab equipment for the rear-side polishing and emitter removal steps, and the SoLayTec in-line spatial ALD process development tool (InPassion LAB) for the ALD-Al2O3 deposition. Within imec's i-PERC process flow, a conversion efficiency of 19.6% with an open circuit voltage Voc of 665mV has been delivered for the best cell, with an average of 19.4% for the small series batch.- See Details
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- 2014-11-08 Innovative metallization process for reliable, high-efficiency solar cells
Imec today announced that it has developed an innovative process for plated front contact formation of silicon solar cells using only one sequence to plate several metals. The large-area solar cells were processed in imec's labs and combine an excellent reliability with a conversion efficiency of 20.3% (certified at Fraunhofer ISE-Callab). The full plating sequence has been transferred to an in-line plating tool enabling high throughput.
The new process for plated contact formation uses one plating sequence (plating Ni, Cu, and Ag), followed by a thermal anneal. This single sequence plating process results in a better aspect ratio and minimal silver usage compared to the standard screen-printed metallization with silver paste. The improved aspect ratio reduces the shadow loss and thus increases the conversion efficiency, while the metallization with mainly copper provides a more sustainable alternative to the currently used silver metallization.
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- 2014-11-08 Uh-oh, Intel. Globalfoundries to fast-forward into 14nm
- (Phys.org)—Globalfoundries has made an announcement that amounts to a direct challenge to Intel, in the latter's race to get further ahead in the mobile device ecosystem. Both Globalfoundries and Intel will be racing for a more dominant position with higher performing and power efficient systems for smartphones and other devices. In short, Globalfoundries announced Thursday that it is accelerating its technology roadmap. Its newest design achievement for the mobile market is in the form of 14nm chip technology. The company provided some details about its 14nm-XM ("extreme mobility") process.
This is a nonplanar architecture optimized for low-power, mobile system-on-chip (SoC) designs. These chips will deliver a 40 percent to 60 percent improvement in battery life compared to two-dimension planar transistors at the 20nm node.
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- 2014-11-08 New LED packaging technology improves performance
(Phys.org)—Many researchers have reported improvements in LED technology by enhancing the properties of the LED itself. But the packaging that secures and protects the LED also impacts its overall performance. In a new study, researchers from Taiwan have designed a "flip glass substrate" for packaging LEDs, and demonstrated improvements in terms of a wider viewing angle, better color uniformity, and earlier identification of flaws during production compared with other LED packaging methods.
The researchers, led by Weileun Fang, a professor at National Tsing Hua University in Hsinchu, Taiwan, have published their study on the flip glass substrate LED packaging in a recent issue of the Journal of Micromechanics and Microengineering.
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- 2014-11-07 Sell JRC(NJRC) all series ICs Voltage Regulators Amplifiers - TAMS SEMICONDUCTOR LIMITED
We (TAMS SEMICONDUCTOR LIMITED) sell JRC(Japan Radio Company) all series electronic components. We are a stocking distributor of JRC electronic components semiconductor.
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- 2014-11-07 STMicroelectronics to showcase cutting-edge contactless solutions
- With the dramatic increase in demand for contactless solutions in healthcare, medical and fitness markets, ST's unique dual-interface EEPROM products should draw a great deal of attention. These EEPROMs deliver valuable information in conjunction with an RFID reader such as in a NFC-enabled smart phone. The EEPROMs are designed to enable both wired and wireless two-way reading/writing with a low-power I2C interface or in ISO15693 mode.
Featuring convenient design features and advanced 'energy harvesting' technology for cost efficiency, the dual-interface EEPROMs also enable power to be supplied autonomously through RF signals. These EEPROMs can help with the development of applications that enable easy monitoring of health information such as blood pressure and body temperature at any time or place. - See Details
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- 2014-11-07 Launch of world's smallest combo chip for automotive keyless entry systems
NXP Semiconductors today announced the NCF2960 – the world's smallest combo chip solution for automotive keyless entry with immobilizer functions. The compact solution uniquely integrates a security transponder, micro RISC kernel, and multi-channel radio transmitter in a single package.
The NCF2960 addresses the strong demand from car OEMs for fashionable and distinctive car key designs. The chip's package size has been reduced by 44% compared to the previous generation. Available in a tiny 24-pin QFN package, it requires only 4-mm x 4-mm of board space, providing key fob manufacturers with maximum design freedom in selecting form factors and in placement of command buttons.
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- 2014-11-07 Wireless data centers could be faster, cheaper, greener
In the "cloud," data is stored and processed in remote data centers. Economies of scale let cloud providers offer these services at far lower cost than buying and maintaining one's own equipment.
But data centers with tens of thousands of computers draw tens of thousands of kilowatts.
"Reducing power consumption would not only cut costs but would be a benefit to the environment," said Hakim Weatherspoon, assistant professor of computer science. Weatherspoon; Emin Gün Sirer, associate professor of computer science; graduate student Ji-Yong Shin; and Darko Kirovski of Microsoft Research have prepared a feasibility study for what they call a "Cayley Data Center," based on wireless networking and named for mathematician Arthur Cayley, who laid out in 1854 the mathematics they used in their design.
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- 2014-11-07 TAMS SEMICONDUCTOR LIMITED Sells IDT all series Integrated Circuits (ICs) Sensors Memory
- Please feel free to contact us when you need any electronic components(semiconductor).
We (TAMS SEMICONDUCTOR LIMITED) a stocking distributor of electronic components, sell IDT(Integrated Device Technology, Inc.) all series Integrated Circuits (ICs). Analog and USB Switches, Audio Solutions, Clock / Timing Devices, Digital Logic Products, Display / Video Solutions, Embedded Host Bridges (EHB), FIFO Products, Memory Interface Products, Multi-Port Memory / Dual-Port RAM, PCI Express® Solutions, Physical Layer Products, Power Management Solutions, Processor Products, RF Products, SRAMs, Serial RapidIO® Solutions, Signal Integrity Products, System Monitors, Telecommunication ICs, Temperature Sensors, Touch Products, VME, electronic components(semiconductor).
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74FCT162245TPV - See Details
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- 2014-11-07 New Renesas ultra-low power consumption MCUs to be used in variety of auto applications
Renesas Electronics Corporation today announced the RH850/F1x Series of 32-bit microcontrollers (MCUs) for automotive body applications as the first products to be released in the RH850 Family of automotive MCUs with on-chip flash memory employing the industry's most advanced 40 nanometer (nm) process.
The new MCUs are designed for use in a variety of automotive body applications and provide many advantages. The RH850/F1xSeries is composed of three groups and has a total of more than 50 products from Low-end to High-end, the RH850/F1L, RH850/F1M and RH850/F1H. Larger on-chip flash memory capacity from 256KB up to 8MB is offered along with more compact package options (48-pin and up). Dual-core versions are also planned to be available in the RH850/F1H Group. The RH850/F1x Series uses the same architecture CPU core and common peripheral functions, and has software compatibility within the same group.- See Details
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- 2014-11-07 Lithographic breakthrough with laser spike anneal to create higher fidelity circuit patterns
Researchers sponsored by Semiconductor Research Corporation (SRC) today announced that they have developed a new laser-based method for ultra-fast anneal of thin photoresist films used to transfer semiconductor patterns onto silicon wafers.
Pioneers in the use of lasers to expedite baking of photoresist and understanding photoresist activation chemistry, Professors. Michael Thompson and Christopher Ober fromMaterials Science and Engineering at Cornell University are perfecting the unique advantages of laser heating versus current state-of-art hotplate bake used in chip patterning processes.
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- 2014-11-07 Distributor of XILINX all series Integrated Circuits (ICs) CPLDs FPGAs Memory - TAMS SEMICONDUCTOR LIMITED
- TAMS SEMICONDUCTOR LIMITED sells XILINX all series Integrated Circuits (ICs),Embedded - CPLDs (Complex Programmable Logic Devices),Embedded - FPGAs (Field Programmable Gate Array), Memory - Configuration Proms for FPGA's, electronic components (semiconductor). We are the stocking distributor of XILINX Integrated Circuits (ICs), electronic components semiconductor.
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