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- 2014-10-24 Transformational research combines solid-state and biological components
An interdisciplinary team of researchers from Columbia University, led by Ken Shepard, professor of electrical engineering and biomedical engineering at Columbia Engineering and including Virginia W. Cornish, Helena Rubinstein Professor of Chemistry, and Lars Dietrich, assistant professor of biological sciences, has won a prestigious $1 million three-year grant from the W. M. Keck Foundation to advance their research in combining biological components with solid-state electronics, creating new systems that exploit the advantages of both.
"Winning this generous Keck grant is critical to moving our research forward," says Shepard, whose group has a long history in developing solid-state interfaces to biological and biomolecular systems.
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- 2014-10-24 TAMS SEMICONDUCTOR LIMITED sells ON SEMI all series ICs diodes transistors electronic components
TAMS SEMICONDUCTOR LIMITED sells ON SEMICONDUCTOR all series Integrated Circuits (ICs), Memory Cards, Modules, Optoelectronics, DIODES, TRANSISTORS, electronic components(semiconductor). We are a stocking distributor of ON SEMICONDUCTOR electronic components semiconductor.
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- 2014-10-23 Computational sprinting with wax takes heat off smartphones
- (Phys.org) —What about using wax with a processor as part of a technique to stave off smartphone overheating? Can wax be the answer to the thermal problem confronting smartphones? That is the proposal coming from a University of Pensylvania and University of Michigan team of researchers, who have been studying ways to manage the chip performance of smartphones. Milo Martin, an associate professor with the University of Pennsylvania and his colleagues at the two schools believe the answer is in computational sprinting involving wax. "When someone cranks the chip well beyond its recommended speeds, the wax absorbs the extra heat coming off the silicon, and at 54 degrees Celsius, it starts to melt," said a report about their research in Wired.
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- 2014-10-23 Cost-saving computer chips get smaller than ever
Not so long ago, a computer filled a whole room and radio receivers were as big as washing machines. In recent decades, electronic devices have shrunk considerably in size and this trend is expected to continue, leading to enormous cost and energy savings, as well as increasing speed.
Key to shrinking devices is Terascale computing, involving ultrafast technology supported by single microchips that can perform trillions of operations per second.
Using Terascale technology, semiconductor components commonly used to makeintegrated circuits for all kinds of appliances could measure less than 10 nanometres within several years. Keeping in mind that a nanometre is less than 1 billionth of a metre, electronic devices have the potential to become phenomenally smaller and require significantly less energy than today - a development that will revolutionise the electronics industry.
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- 2014-10-23 The '50-50' chip: Memory device of the future?
A new, environmentally-friendly electronic alloy consisting of 50 aluminum atoms bound to 50 atoms of antimony may be promising for building next-generation "phase-change" memory devices, which may be the data-storage technology of the future, according to a new paper published in the journal Applied Physics Letters, which is produced by AIP Publishing.
Phase-change memory is being actively pursued as an alternative to the ubiquitous flash memory for data storage applications, because flash memory is limited in its storage density and phase-change memory can operate much faster.
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- 2014-10-23 How your smartphone got so smart
In 1947, the Cold War, David Letterman, and the CIA were born; the future Queen Elizabeth got married; and a U.S. postage stamp cost 3 cents. That was also the year the seed that would eventually grow into smartphones first took root.
The seed didn't look that impressive, at least not next to the flashier rockets for outer spacethat other scientists and engineers were building at the same time.
Three scientists at AT&T's Bell Laboratories in New Jersey were tinkering with a device that would turn an electrical signal on and off. The dime-sized contraption, cobbled together out of germanium and gold, turned out to be the reason why you can get email from a person halfway around the world, look up restaurant reviews on your phone, and get driving directions from your car.
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- 2014-10-23 Research brings unbreakable phones one step closer
Breakthrough research at RMIT University is advancing transparent bendable electronics, bringing science fiction gadgets – such as unbreakable rubber-like phones, rollable tablets and even functional clothing – closer to real life.
Researchers from RMIT's Functional Materials and Microsystems research group have developed a new method to transfer electronics with versatile functionality, which are usually made on rigid silicon, onto aflexible surface.
The result of their work was published last week in Nature Publishing Group's Asia Materials, the leading materials science journal for the Asia-Pacific.
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- 2014-10-23 Applied Materials in takeover of Tokyo Electron (Update 2)
Chip-making equipment manufacturer Applied Materials is acquiring Tokyo Electron Ltd., a rival maker of equipment for production of semiconductors, flat panel displays and solar panels.
The two companies said Tuesday their $9.39 billion all-stock transaction will result in the creation of a new company with a market capitalization of about $29 billion.
Tokyo Electron's chairman Tetsuro Higashi said the deal is meant to create a "truly global company" to meet the needs of companies supplying consumer electronics, such as smartphones and tablets.
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- 2014-10-23 Establishing basic formulas for squeezing wireless energy from radio frequency systems
Radio-frequency (RF) wave rectifier circuits play an invaluable role in extracting the appropriate DC voltage and current in wireless energy applications, such as mobile power supplies and environmental energy harvesting.
To squeeze the maximum power from an RF source, circuit designers have to repeat a process of rectifier topology implementation and element parameter optimization for each system. This approach necessitates extensivenumerical simulation and computing resources.
Here, Takashi Ohira at Toyohashi Tech. describes the establishment of a set of mathematical formulas that can characterize RF diode rectifiers.
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- 2014-10-23 New photoresist technology for organic semiconductors enabling submicron patterns
- FUJIFILM Corporation and imec have developed a new photoresist technology for organic semiconductors that enables the realization of submicron patterns.
Due to their lightness, flexibility, and the possibility to manufacture them in large area, research and development on organic semiconductors has intensified in recent years. Organic semiconductors can be used in various applications such as organic solar cells, flexible displays, organic photodetectors and various other types of sensors. Current methods for patterning organic semiconductors include shadow masking and inkjet printing. However, these patterning methods are not suitable for high-resolution patterning on large-size substrates. - See Details
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- 2014-10-23 'We should stop designing perfect circuits'
- Are integrated circuits "too good" for current technological applications? Christian Enz, the new Director of the Institute of Microengineering, backs the idea that perfection is overrated.
Christian Enz, the head of the Integrated Circuits Laboratory (ICLAB), explains why we should build our future devices with unreliablecircuits, and adopt the "good enough engineering" trend. Non-fully reliable circuits can lead to a substantial reduction of energy consumption. Even better, they will allow scientists to stay in the miniaturization race, which has been compromised of late. The size of transistors that constitute circuits cannot be reduced boundlessly. As they get smaller and smaller, they produce more and more mistakes. - See Details
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- 2014-10-23 New SiC diodes make converters more efficient
Using new silicon carbide (SiC) diodes, Siemens and its research partners have succeeded in increasing the power of frequency converters by almost ten percent. In the recently ended project MV-SiC, these diodes were tested in the sort of commercial converters used for large drives. SiC diodes reduce the complexity of the system, and because they have lower losses, they also increase energy efficiency. Another result is that the switching frequency of converters can be increased by approximately a third, which boosts the performance and speed range of the drives. Siemens managed the project, and it was funded by the German Federal Ministry of Education and Research as part of the program Power Electronics for Raising Energy Efficiency.
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- 2014-10-22 Nanodevices for a 'More than Moore' world
Moore's Law - which holds that the number of transistors on an integrated circuit, and hence its processing power, doubles every 18 months - has been the guiding principal of chip design for almost half a century. But with physical limitations to further transistor scaling being reached, Moore's Law may have met its match. We are entering a 'More than Moore' world in which EU-funded researchers are playing an important role.
Since Intel co-founder Gordon E. Moore described his theory in 1965, circuit designers have counted on the steady increase in transistor density to provide greater chip performance in ever smaller packages. Now, however, some of the physical constraints to transistor scaling - such as overheating, energy dissipation and resistance -mean that conventional semiconductor design approaches are unlikely to produce the same rate of progress.
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- 2014-10-22 Laser thermal anneal to boost performance of 3-D memory devices
Nanoelectronics research center imec and Excico, a global leader in semiconductor laser annealing, have successfully demonstrated the application of laser thermal anneal (LTA) to boost the current in vertical polysilicon channel devices for 3D memory. Due to the larger grain size of the laser recrystallized polycrystalline channel material, up to 10 times higher read current and 2.5 times steeper sub-threshold slope could be obtained as compared to conventional polysilicon channel. This technique provides a way to higher stacking and therefore higher bit density in 3D memory.
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- 2014-10-22 Dolphins inspire rescue radar device
British engineers said Wednesday they had taken inspiration from dolphins for a new type of radar device that could easily track miners trapped underground or skiers buried in an avalanche.
The device, like dolphins, sends out two pulses in quick succession to allow for a targeted search for semiconductor devices, cancelling any background "noise", the team wrote in the journal Proceedings of the Royal Society A: Mathematical and Physical Sciences.
With more accuracy and speed than conventional radar, their device was able to pick up roadside bombs, bugging devices or mobile phones even in areas with a lot of metal "clutter", said study co-author Timothy Leighton of the University of Southampton's engineering faculty.
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- 2014-10-22 Novel microfluidic material breakthrough for wafer-scale mass production of lab-on-chip
Imec, a world-leading nanoelectronics research center and JSR, a leading materials company, announce that they have successfully used JSR's innovative PA (Photo-patternable Adhesive) material for wafer-scale processing of lab-on-chip devices. With PA as a key enabling material, imec has processed microfluidic cell-sorter devices, merging microheaters and sensors with wafer-scale polymer microfluidics. PA is a breakthrough material: a good microfluidic channel material and adhesive at the same time, suitable for wafer-scale processes and mass production.
Lab-on-chip technology will drive a revolution in medical technology in the years to come. It will enable powerful point-of-care diagnosis and treatment through on-chip molecular synthesis, separation, sensing, and detection. Key will be the ability to integrate microfluidics with heterogeneous components such as electronics, sensors, microheaters, and photonics in a cost-effective manner. To merge these elements successfully, new bonding and surface treatment materials are needed.
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- 2014-10-22 NPL leads research project to help deliver 10x faster computer processing speeds
- A new international research collaboration announced today will deliver highly accurate measurements of strain in materials at the nano-scale to drive innovation in next generation electronic devices. The European Metrology Research Programme's Nanostrain project brings together public institutions from across Europe supported by global industry leaders including IBM. A particular focus for the consortium is a class of materials (piezoelectrics) that change their shape in response to electric voltages. The project aims to advance commercial opportunities arising from controlled strain in nano-scale piezoelectrics including the development of the first Piezoelectric-Effect-Transistor (PET), a new digital switch with the potential to offer increased speed, reduced micro-chip size and lower power consumption.
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- 2014-10-22 3-D gesture-recognition chip could be a boon to wearable gadgets (w/ Video)
Researchers at Berkeley Engineering and UC Davis are developing a tiny chip that uses ultrasound waves to detect a slew of gestures in three dimensions. The technology, called Chirp, could eventually be used in everything from helmet cams to smart watches.
As the MIT Technology Review reports, the technology is slated to be spun out into its own company, Chirp Microsystems, to produce the chips and sell them to hardware manufacturers.
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- 2014-10-22 Imec demonstrates world's first III-V FinFET devices monolithically integrated on 300mm silicon wafers
- Imec, a leading nanoelectronics research center, announced today that it has successfully demonstrated the first III-V compound semiconductor FinFET devices integrated epitaxially on 300mm silicon wafers, through a unique silicon fin replacement process. The achievement illustrates progress toward 300mm and future 450mm high-volume wafer manufacturing of advanced heterogeneous CMOS devices, monolithically integrating high-density compound semiconductors on silicon. The breakthrough not only enables continual CMOS scaling down to 7nm and below, but also enables new heterogeneous system opportunities in hybrid CMOS-RF and CMOS-optoelectronics.
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- 2014-10-22 Multilayer varistors: Ultra-flat and compact varistors for ESD protection
TDK Corporation presents a new series of EPCOS multilayer varistors of the CeraDiode family, which includes the most compact, flattest and most rugged varistor for the ESD protection of mobile equipment. It has a footprint of only 0.47 mm x 0.47 mm at an extremely low profile of 0.1 mm in LGA packaging. These new SMD protection components are available in EIA case sizes of 0402, 0201 and even smaller. This enables the production of varistors that are thus about 80 percent smaller than their predecessors and simultaneously offer extremely reliable ESD protection.
The new CeraDiodes have an ESD immunity of 15 kV or 25 kV, depending on the type, which more than satisfies the higher requirements on the ESD protection of sensitive ICs. Their clamping voltage is only 70 V or 90 V at a pulse voltage of 8 kV (IEC-61000-4-2), depending on the type. Thanks to their low capacitance, the signal integrity of high-speed interfaces such as HDMI is not impaired.
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- 2014-10-22 EMC components: World's smallest common-mode choke for automotive Ethernet
TDK Corporation presents a new series of common-mode chokes for automotive Ethernet that features the world's best common-mode noise suppression. Measuring in with a footprint of 4.5 mm x 3.2 mm and an insertion height of just 2.8 mm, the miniaturized ACT45L series is the world's smallest common-mode choke for automotive Ethernet and fulfills the standard's stiffest requirements. Mass production of the new common-mode choke starts in November 2013.
Ethernet, which supports data rates of up to 100 Mbit/s, is quickly becoming the networking protocol of choice for high-speed multimedia infotainment applications in cars. Because it employs lightweight unshielded twisted-pair (UTP) wires, automotive Ethernet is able to save space and weight. The specifications of the new automotive Ethernet standard with regard to common-mode noise suppression are significantly more demanding than the requirements of CAN and FlexRay.- See Details
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- 2014-10-22 NXP TFA9895 enhances mobile audio sound quality with multi-band speaker boost
- Will your next mobile phone have built-in stereo speakers? As handset makers focus increasingly on audio quality, consumers can look forward to phones and other mobile devices that achieve higher sound quality than ever before, without relying on headphones and accessories. With over 20 million first-generation speaker driver ICs shipped in the first 12 months, NXP Semiconductors is now introducing the TFA9895 – its second-generation speaker boost solution – which further improves the sound quality of handsets and tablets via a new multi-band compression feature which enhances the way music and voice sound, even at louder speaker volumes.
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- 2014-10-21 Fujitsu releases new 4 mbit FRAM with non-volatile memory with SRAM-compatible parallel interface
Fujitsu Semiconductor Limited announced the development of the MB85R4M2T, a 4 Mbit FRAM chip with an SRAM-compatible parallel interface. The new product will be made available in sample quantities starting January 2014. It uses a 44-pin TSOP package compatible with standard low-power SRAM, so it can substitute for SRAM in industrial machinery, office equipment, medical devices, security systems, and other equipment that currently uses SRAM. Because it stores data persistently with no need of a battery, it contributes to hardware that is more compact, less power-hungry, and lower in total cost.
FRAM is a type of memory that features both non-volatility, which allows data to be retained even when the power is switched off, and random access, which enables fast data writing. Because FRAM can safely store data that is being written even at sudden power source failures and power outages, it is possible to ensure the protection of parameter information and log data in equipment recorded immediately preceding a power source outage.
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- 2014-10-21 Fujitsu semiconductor introduces innovative methodology for leading-edge "Customized soC" design
Fujitsu Semiconductor today announced that it has developed a new design methodology that enables both the higher circuit density and the shorter development time, for advanced 28nm SoC (System on a Chip) devices. Incorporating the new methods can improve the circuit density by 33%, and reduce the time for final layout process to as short as one month. It will be integrated into the company's new Customized SoC Solutions, and will be available for the development of RTL-handoff SoCs for customers. Fujitsu will start accepting orders to develop SoCs using the new methodology in February 2014.
SoCs with the leading-edge technology, such as 28nm process, are required to have more and more functionality and performance, which drive the need for more circuits packed into the chip. Designing such SoCs is becoming increasingly complex and taking significantly longer development time, while addressing the power consumption is also becoming more challenging. In order to cope with such difficult SoC design, Fujitsu semiconductor has developed innovative design methods that enable higher density, shorter development time, and lower power consumption.
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- 2014-10-21 Monolithic ultrasonic integrated circuits
Ultrasonography based on traditional bulk piezoelectric transducers has been established as an inexpensive and safe medical imaging modality. By borrowing techniques from the microelectronics industry, the performance of the ultrasound transducer can be dramatically improved and new applications become feasible. Dr. Arman Hajati and his co-workers from Fujifilm Dimatix (FDMX), Santa Clara CA, have developed a high performance ultrasound transducer technology. This novel transducer technology is based on an array of three-dimensional micromachined semi-ellipsoidal piezoelectric domes made of the high-quality PZNT thin film developed at FDMX. This work is published in the journal Applied Physics Letters on November 11, 2013.
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- 2014-10-21 Ultra-low power 100 gbps ethernet IC developed
Each day, billions of people surf the Internet for information, entertainment, and education. The Internet contains an immeasurable amount of information and knowledge generated every minute all around the world, which is readily available to everyone at the quick click of a computer mouse. The real magic of the Internet, however, lies in data centers where hundreds of billions of data are stored and distributed to a designated user around the clock.
Today, almost every business or organization has its own data centers or outsources data center services to a third party. The centers house highly specialized equipment responsible for the support of computers, networks, data storage, and business security. Accordingly, the operational cost of data centers is tremendous because they consume a great amount of electricity.
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- 2014-10-21 Unravelling the mind-body connection with power-efficient IC chip
- Despite the advances in neuroscience research, the human brain remains a complex puzzle with questions unanswered about how it controls human behaviour, cognitive functions and movements. Scientists from A*STAR Institute of Microelectronics, Nanyang Technological University and National University of Singapore have jointly developed and demonstrated an integrated circuit (IC) chip with record-low power consumption for direct recording of brain activities. This breakthrough minimises the patient's exposure to electromagnetic radiation and heat during the recording process, making it possible to integrate greater number of channels (>100 channels) to acquire more comprehensive profile of brain signals, paving the way to unlock the mystery behind the complex mind-body connection.
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- 2014-10-21 Image sensors for high performance applications
Imec, the Belgian nanoelectronics research center, will present at this week's 'CMOS Image Sensors for High Performance Applications' workshop in Toulouse (France) a prototype of a high-performance, time-delay-integration (TDI) image sensor. The image sensor is based on imec's proprietary embedded charge-coupled device (CCD) in CMOS technology. Imec developed and fabricated the sensor for the French Space Agency, CNES, which plans to utilize the technology for space-based earth observation.
The prototype image sensor combines a light-sensitive, CCD-based TDI pixel array with peripheral CMOS readout electronics. By integrating CCD with CMOS technology, imeccombined the best of both worlds. The CCD pixel structure delivers low-noise TDI performance in the charge domain, while CMOS technology enables low-power, on-chip integration of fast and complex circuitry readouts.
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- 2014-10-21 Imec simplifies i-PERC solar cell processing by implementing laser doping from ALD-Al2O3
Nanoelectronics research centre IMEC announced today that they have developed large area (156x156mm2) i-PERC-type silicon solar cells using a new processing sequence based on laser doping from a thin atomic layer deposited (ALD) aluminum oxide (Al2O3) layer to realize the local aluminum Back Surface Field (BSF) and Ni/Cu plating to form the front contact. The cells achieved average conversion efficiencies of 20.2%.
The new laser doping processing sequence eliminates the necessity of a firing step to create the local BSF in i-PERC solar cells. Combined with imec's Ni/Cu plating sequence for front contact formation, it provides a low temperature metallization solution for i-PERC cells. By avoiding high temperature conditions, passivation degradation of the rear Al2O3 layer, as well as optical degradation of the rear dielectric/metal stack are prevented, resulting in improved solar cell conversion efficiency.- See Details
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- 2014-10-21 Bluetooth Smart radio with record battery lifetime
Imec, Holst Centre and Wicentric introduce today their integrated ultra-low power Bluetooth Smart radio solution for a range of smart applications. With a power consumption up to five times lower than state-of-the-art radios and an extremely small memory footprint, this radio solution, integrating imec and Holst Centre's 2.4GHz ultra-low power radio and Wicentric's exactLE product line of Bluetooth® Smart software, leads the way to new Internet of Things applications such as personal health monitoring systems and smart home applications.
Autonomous wireless sensor systems running on batteries or energy harvested in the environment can be used for personal health monitoring, smart homes, intelligent cars, and for monitoring machines, buildings or the environment. However, practical applications for wireless sensor networks largely depend on their size, autonomy, and power consumption.
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